- 分享到:
Comments: A: After seeing the defect board picture, we can found the obviously copper exposed. Although FQC has the risk of Leak detection, it is impossible to miss such a serious problem, so we judge this defect happened after FQC. B：Customer found the defect after SMT, we judge the defect happen after SMT, and it is the solder mask peeling caused the copper exposed in SMT. C:Because it is the solder mask peeling, we conclude it is the copper Copper surface pollution or copper surface oxidation before solder mask printing, and caused the cppper exposed.And we will review the solder mask process.
